Integrated circuit card

ABSTRACT

An integrated circuit card ( 200 ) is described. The integrated circuit card comprises a card body having an opening ( 310 ) extending through the thickness of the card body ( 306 ); and two components located in the card body ( 204 ) opening ( 310 ), wherein a first component ( 214 ) of the two components includes an integrated circuit.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a U.S. National Stage filing under 35 U.S.C. §119,based on and claiming benefits of and priority to GB Patent ApplicationNo. 15194164.8 filed Nov. 11, 2015.

FIELD OF DISCLOSURE

The present disclosure relates to an integrated circuit card. Inparticular, but not exclusively, the present disclosure relates to anintegrated circuit card comprising at least two integrated circuits, andmethods of manufacturing an integrated circuit card comprising at leasttwo integrated circuits.

BACKGROUND OF DISCLOSURE

Integrated Circuit Cards (ICC) are widely used as transaction devices(e.g. credit cards) for securely storing user data for paymenttransactions. ICC's are also widely used as subscriber identity module(SIM) cards for telecommunication devices. Typically, ICC's comprise anembedded integrated circuit in a body made of plastic. Many ICC'scommunicate data and obtain power through an electrical contact plate onthe surface of the housing that connects to the integrated circuit.

FIG. 1(a) shows a front view of a typical ICC 100. The ICC 100 comprisesan integrated circuit module 102 (i.e. a component) arranged in a body104.

FIG. 1(b) shows a cross-sectional side view section along a line A-A ofthe ICC 100, in the region of the integrated circuit module 102. Thebody 104 comprises a recess 106 in which the integrated circuit module102 is located. The integrated circuit module 102 comprises anelectrical contact plate 108, a circuit board 110, an integrated circuit112 and encapsulant 114.

FIG. 1(c) shows the shape of the recess 106 more clearly (illustratedwithout the integrated circuit module 102). The recess 106 comprises aperipheral portion 120 and a main portion 122. The peripheral portion120 is shallower than the main portion 122. The peripheral portion 120is arranged to contain the electrical contact plate 108 and the circuitboard 110 such that the electrical contact plate 108 is substantiallyflush with the surface of the body 104. Accordingly, the depth of theperipheral portion 120 is substantially the same as the total combinedthickness of the electrical contact plate 108 and the circuit board 110.The main portion 122 is arranged to contain the circuit board 110, theintegrated circuit 112 and the encapsulant 114, underneath theelectrical contact plate 108.

The electrical contact plate 108 is connected to a first side of thecircuit board 110, and the integrated circuit 112 is connected to asecond side of the circuit board 110. Generally, the integrated circuit112 comprises a microcontroller. The integrated circuit 112 iselectrically insulated by the encapsulant 114. For example, theencapsulant may comprise epoxy. Additionally, during manufacture(typically by lamination) of the ICC 100, the volume of encapsulant 114may be controlled to ensure correct placement of the integrated circuitmodule 102.

Against this background, the present disclosure aims to provide animproved integrated circuit card comprising at least two integratedcircuits.

SUMMARY OF DISCLOSURE

According to an aspect of the disclosure, there is provided anintegrated circuit card comprising a card body having an openingextending through the thickness of the card body; and two componentslocated in the opening, wherein a first component of the two componentsincludes an integrated circuit.

Optionally, a second component of the two components includes one ormore from a group comprising: an integrated circuit; a switch; adisplay; a sensor; a transducer; or a combination thereof. For example,the sensor may be fingerprint sensor or a pressure sensor, and thedisplay may be an LCD or an e-paper display.

Optionally, the two components have a combined thickness that issubstantially the same thickness as the card body.

Optionally, the card body comprises an upper surface and a lowersurface, and the two components within the opening comprise an uppersurface and a lower surface, wherein the upper and the lower surfaces ofthe two components are substantially flush with the upper and the lowersurfaces of the card body. Optionally, wherein the card body comprises arear side and a front side, wherein the opening is larger at the frontside than the rear side.

The integrated circuit card may comprise an International MobileSubscriber Identity.

Optionally, the integrated circuit comprises a secure element.

The integrated circuit card may comprise a Near Field Communicationantenna in communication with the integrated circuit. Optionally, theNear Field Communication antenna is arranged to connect to the antennaof a mobile device.

Optionally, the card body comprises alignment means for aligning theintegrated circuit card relative to contact pins on a mobile device whenthe front side of the card is presented to the contact pins and whereinthe alignment means is arranged to align the card relative to thecontact pins when the back side of the card is presented to the contactpins. The alignment means may comprise two adjacent corners of the card.

According to an aspect of the disclosure, there is provided a method ofmaking an integrated circuit card, the method comprising: providing acard body having an opening, a rear side and a front side, wherein theopening is larger at the front side than the rear side of the card body;inserting a module in the opening from the front side of the card,wherein the module is substantially the same thickness as the card body,and the module comprises two components, a front side and a rear side,wherein a first component of the two components includes an integratedcircuit; and arranging the integrated circuit module so that the frontside of the module is substantially level with the front side of thecard body, and the rear side of the module is substantially level withthe rear side of the card body.

An integrated circuit card may be made using the method above.

BRIEF DESCRIPTION OF THE FIGURES

FIGS. 1(a), 1(b) and 1(c) have already been described above by way ofbackground, in which:

FIG. 1(a) is a schematic front view of a prior art integrated circuitcard;

FIG. 1(b) is a schematic cross-sectional side view along a line A-A ofthe integrated circuit card of FIG. 1(a); and

FIG. 1(c) is a schematic cross-sectional side view along a line A-A of arecess in the integrated circuit card of FIG. 1(a).

The disclosure will now be described in detail by way of example only,with reference to the remaining drawings, in which:

FIG. 2(a) is a schematic front view of an integrated circuit cardcomprising two integrated circuits sharing a common electrical contactaccording to an example useful for understanding the disclosure;

FIG. 2(b) is a schematic cross-sectional side view along a line B-B ofthe integrated circuit card of FIG. 2(a);

FIG. 2(c) is a schematic cross-sectional side view along a line B-B of arecess in the integrated circuit card of FIG. 2(a);

FIG. 3(a) is a schematic front view of an integrated circuit cardcomprising two integrated circuits according to an embodiment of thedisclosure;

FIG. 3(b) is a schematic rear view of the integrated circuit card ofFIG. 3(a);

FIG. 3(c) is a schematic cross-sectional side view along a line C-C ofthe integrated circuit card of FIG. 3(a);

FIG. 3(d) is a schematic cross-sectional side view along a line C-C ofan opening in the integrated circuit card of FIG. 3(a);

FIG. 4(a) is a schematic front view of an integrated circuit cardcomprising a stacked die assembly according to an embodiment of thedisclosure;

FIG. 4(b) is a schematic rear view of the integrated circuit card ofFIG. 4(a);

FIG. 4(c) is a schematic cross-sectional side view along a line D-D ofthe integrated circuit card of FIG. 4(a);

FIG. 4(d) is a schematic cross-sectional side view along a line D-D ofan opening in the integrated circuit card of FIG. 4(a);

FIG. 5(a) is a schematic front view of an integrated circuit cardcomprising a rear module according to an embodiment of the disclosure;

FIG. 5(b) is a schematic rear view of the integrated circuit card ofFIG. 5(a);

FIG. 5(c) is a schematic cross-sectional side view along a line E-E ofthe integrated circuit card of FIG. 5(a);

FIG. 5(d) is a schematic cross-sectional side view along a line E-E ofan opening in the integrated circuit card of FIG. 5(a);

FIG. 6(a) is a schematic front view of an integrated circuit cardcomprising two integrated circuits according to an embodiment of thedisclosure;

FIG. 6(b) is a schematic rear view of the integrated circuit card ofFIG. 6(a);

FIG. 6(c) is a schematic cross-sectional side view along a line F-F ofthe integrated circuit card of FIG. 6(a);

FIG. 6(d) is a schematic cross-sectional side view along a line F-F ofan opening in the integrated circuit card of FIG. 6(a);

FIG. 7(a) is a schematic front view of an integrated circuit cardcomprising a rear module according to an embodiment of the disclosure;

FIG. 7(b) is a schematic rear view of the integrated circuit card ofFIG. 7(a);

FIG. 7(c) is a schematic cross-sectional side view along a line G-G ofthe integrated circuit card of FIG. 7(a); and

FIG. 7(d) is a schematic cross-sectional side view along a line G-G ofan opening in the integrated circuit card of FIG. 7(a);

DETAILED DESCRIPTION

Specific embodiments are described below with reference to the figures.

FIG. 2(a) shows a front view of an ICC 200 according to an exampleuseful for understanding the disclosure. The ICC 200 comprises anintegrated circuit module 202 arranged in a body 204. The ICC 200includes two distinct components (e.g. two distinct integrated circuits)that can be accessed using a common electrical contact. As shown in FIG.2(a) the electrical contact takes the form of an electrical contactplate. However, it is to be appreciated that other electrical contactconfigurations are possible.

FIG. 2(b) shows a cross-sectional side view section along a line B-B ofthe ICC 200, in the region of the integrated circuit module 202. Thebody 204 comprises a recess 206 in which the integrated circuit module202 is located. The integrated circuit module 202 comprises anelectrical contact plate 208, a circuit board 210, an interface chip212, a first integrated circuit 214, a second integrated circuit 216, afirst set of interconnects 218, a second set of interconnects 220 and athird set of interconnects 222. Each of the sets of interconnectscomprises a plurality of interconnects.

FIG. 2(c) shows the shape of the recess 206 more clearly (illustratedwithout the integrated circuit module 202). The recess 206 issubstantially the same shape as the recess 106 of a typical prior artICC 100 illustrated in FIG. 1(c). The recess 206 comprises a peripheralportion 240 and a main portion 242. The peripheral portion 240 isshallower than the main portion 242.

The peripheral portion 240 is arranged to contain the electrical contactplate 208 and the circuit board 210 such that the electrical contactplate 208 is substantially flush with the surface of the body 204.Accordingly, the depth of the peripheral portion 240 is substantiallythe same as the total combined thickness of the electrical contact plate208 and the circuit board 210. The main portion 242 is arranged tocontain the circuit board 210, the interface chip 212, the integratedcircuits 214, 216, the sets of interconnects 218, 220, 222, allunderneath the electrical contact plate 208.

In some examples, encapsulant may be used to fill any voids in therecess 206.

The electrical contact plate 208 is connected to a first side of thecircuit board 210. A second side of the circuit board 210 is connectedto a first side of the interface chip 212 via the first set ofinterconnects 218. A second side of the interface chip 212 is connectedto the first integrated circuit 214 via the second set of interconnects220. The second side of the interface chip 212 is also connected to thesecond integrated circuit 216 via the third set of interconnects 222.

The interface chip 212 is arranged to communicate data to and from boththe first integrated circuit 214 and the second integrated circuit 216,either simultaneously or individually. The interface chip is furtherarranged to supply power to both the first and the second integratedcircuit 214, 216.

For example, if the ICC 200 was for a transaction device, the firstintegrated circuit 214 and the second integrated circuit 216 may eachcomprise a secure element including transaction applications andcryptographic data that enable the ICC 200 to be used in secure paymenttransactions. When the ICC 200 is connected to a suitable point ofinteraction (e.g. a point of sale terminal), the selection between thesecure elements of the first integrated circuit 214 and the secondintegrated circuit 216 may be made on the point of interaction.

Alternatively, if the ICC 200 was for a SIM card, the first integratedcircuit 214 and the second integrated circuit 216 may each comprise aunique International Mobile Subscriber Identity (IMSI) for connecting tocellular telecommunications networks. When the ICC 200 is connected to asuitable user device (e.g. a mobile phone or tablet computer), theselection between the IMSI's of the first integrated circuit 214 and thesecond integrated circuit 216 may be made on the user device.

FIG. 3(a) shows a front view of an ICC 300 according to an embodiment ofthe disclosure. FIG. 3(b) shows a rear view of the ICC 300. The ICC 300comprises a first integrated circuit module 302 and a second integratedcircuit module 304 arranged in a body 306. The first integrated circuitmodule 302 is proximal to a front surface of the ICC 300, and the secondintegrated circuit module 304 is proximal to a rear surface of the ICC300. In this embodiment, the body 306 is substantially the shape of astandard mini-SIM card but with two notched corners 308 a, 308 b(instead of one in a standard mini-SIM card) for aligning and locatingthe ICC 300 relative to contact pins on a user device. The additionalnotched corner (compared to the standard mini-SIM) enables the ICC 300to be reversible.

FIG. 3(c) shows a cross-sectional side view section along a line C-C ofthe ICC 300, in the region of the integrated circuit modules 302, 304.The body 306 comprises an opening 310 through the thickness of the body306. The first and the second integrated circuit modules 302, 304 arelocated in the opening 310. The first integrated circuit module 302comprises a front electrical contact plate 312, a front circuit board314 and a front integrated circuit 316. The second integrated circuitmodule 304 comprises a rear electrical contact plate 318, a rear circuitboard 320 and a rear integrated circuit 322. The rear electrical contactplate 318 is smaller than the front electrical contact plate 312.

FIG. 3(d) shows the shape of the opening 310 more clearly (illustratedwithout the integrated circuit modules 302, 304). The opening 310comprises a through portion 340, a front peripheral portion 342 and arear lip 344. The through portion 340 comprises a hole that extendsthrough the thickness of the body 306.

The front peripheral portion 342 is shallower than the thickness of thebody 306. The front peripheral portion 342 is arranged to contain thefront electrical contact plate 312 and the front circuit board 314 suchthat the front electrical contact plate 312 is substantially flush withthe surface of the body 306. Accordingly, the depth of the frontperipheral portion 342 is substantially the same as the total combinedthickness of the front electrical contact plate 312 and the frontcircuit board 314. The rear lip 344 reduces the size of the throughportion 340.

The front electrical contact plate 312 is connected to a first side ofthe front circuit board 314, and the front integrated circuit 316 isconnected to a second side of the front circuit board 314. The rearelectrical contact plate 318 is connected to a first side of the rearcircuit board 320, and the rear integrated circuit 322 is connected to asecond side of the rear circuit board 320. The first integrated circuitmodule 302 and the second integrated circuit module 304 are electricallyisolated from each other.

The opening 310 is arranged such that, during manufacture, the firstintegrated circuit module 302 and the second integrated circuit module304 can be inserted into the body 306 together in one action.

In other embodiments, the opening 310 does not comprise a rear lip 344.In some embodiments, encapsulant may be used to fill any voids in therecess 310.

FIG. 4(a) shows a front view of an ICC 400 according to an embodiment ofthe disclosure. FIG. 4(b) shows a rear view of the ICC 400. The ICC 400comprises an integrated circuit module 402 arranged in a body 404. Theintegrated circuit module 402 extends from a front surface of the ICC400 to a rear surface of the ICC. The integrated circuit module 402comprises a display 406 (i.e. a component) on the rear surface of theICC 400.

FIG. 4(c) shows a cross-sectional side view section along a line D-D ofthe ICC 400, in the region of the integrated circuit module 402. Thebody 404 comprises an opening 410 through the thickness of the body 404.In addition to the display 406, the integrated circuit module 402comprises a front electrical contact plate 412, a front circuit board414, a rear circuit board 416, a stacked die assembly 418, a first setof interconnects 420 and a second set of interconnects 422. Each of thesets of interconnects comprises a plurality of interconnects.

FIG. 4(d) shows the shape of the recess 410 more clearly (illustratedwithout the integrated circuit module 402). The opening 410 comprises athrough portion 440, a front peripheral portion 442 and a rear lip 444.The through portion 440 comprises a hole that extends through thethickness of the body 404.

The front peripheral portion 442 is shallower than the thickness of thebody 404. The front peripheral portion 442 is arranged to contain thefront electrical contact plate 412 and the front circuit board 414 suchthat the front electrical contact plate 412 is substantially flush withthe surface of the body 404. Accordingly, the depth of the frontperipheral portion 442 is substantially the same as the total combinedthickness of the front electrical contact plate 412 and the frontcircuit board 414. The rear lip 444 reduces the size of the throughportion 440.

The front electrical contact plate 412 is connected to a first side ofthe front circuit board 414. A second side of the front circuit board414 is connected to a first side of the stacked die assembly 418 via thefirst set of interconnects 420. The display 406 is connected to a firstside of the rear circuit board 416. A second side of the rear circuitboard 416 is connected to a second side of the stacked die assembly 418via the second set of interconnects 422.

The opening 410 is arranged such that, during manufacture, theintegrated circuit module 402 can be inserted into the body 404 togetherin one action.

The stacked die assembly 418 comprises an integrated circuit and adisplay driver integrated circuit. The display 406 may be an electronicpaper display, for example capable of retaining static text and imagesindefinitely without power. In FIG. 4(b), the display 406 is illustratedas displaying the text ‘521’.

For example, if the ICC 400 was a transaction device, the display 406could be used to provide a temporary Card Verification Value (CVV)number that is determined by the integrated circuit of the stacked dieassembly 418 and updated on the display 406 when the payment device isconnected to a point of interaction. A temporary CVV number wouldprovide additional security for card-not-present transactions comparedto a printed CVV. Alternatively, the display 406 could be used todisplay a machine readable code (e.g. Quick Response code, barcodeetc.). The code would be determined by the integrated circuit of thestacked die assembly 418 and updated on the display 406 when the paymentdevice is connected to a point of interaction. The code could then bescanned by a camera in a phone, tablet or laptop for use in onlinecard-not-present transactions.

FIG. 5(a) shows a front view of an ICC 500 according to an embodiment ofthe disclosure. FIG. 5(b) shows a rear view of the ICC 500. The ICC 500comprises an integrated circuit module 502 arranged in a body 504. Theintegrated circuit module 502 extends from a front surface of the ICC500 to a rear surface of the ICC. The integrated circuit module 502comprises a display 506 on the rear surface of the ICC 500.

FIG. 5(c) shows a cross-sectional side view section along a line E-E ofthe ICC 500, in the region of the integrated circuit module 502. Thebody 504 comprises an opening 510 through the thickness of the body 504.In addition to the display 506, the integrated circuit module 502comprises a front electrical contact plate 512, a front circuit board514, an integrated circuit 516, a display driver integrated circuit 518,an interface chip 520, a rear circuit board 522, a first set ofinterconnects 524, a second set of interconnects 526, a third set ofinterconnects 528 and a fourth set of interconnects 530. Each of thesets of interconnects comprises a plurality of interconnects.

FIG. 5(d) shows the shape of the recess 510 more clearly (illustratedwithout the integrated circuit module 502). The opening 510 comprises athrough portion 540, a front peripheral portion 542 and a rear lip 544.The through portion 540 comprises a hole that extends through thethickness of the body 504.

The front peripheral portion 542 is shallower than the thickness of thebody 504. The front peripheral portion 542 is arranged to contain thefront electrical contact plate 512 and the front circuit board 514 suchthat the front electrical contact plate 512 is substantially flush withthe surface of the body 504. Accordingly, the depth of the frontperipheral portion 542 is substantially the same as the total combinedthickness of the front electrical contact plate 512 and the frontcircuit board 514. The rear lip 544 reduces the size of the throughportion 540.

The front electrical contact plate 512 is connected to a first side ofthe front circuit board 514. A second side of the front circuit board514 is connected to a first side of the interface chip 520 via the firstset of interconnects 524. The interface chip 520 is connected on asecond side to the integrated circuit 516 via the second set ofinterconnects 526. The second side of the interface chip 520 is alsoconnected to a first side of the display driver integrated circuit 518via the third set of interconnects 528. A second side of the displaydriver integrated circuit 518 is connected to a first side of the rearcircuit board 522 via the fourth set of interconnects 530. A second sideof the rear circuit board 522 is connected to the display 506.

The opening 510 is arranged such that, during manufacture, theintegrated circuit module 502 can be inserted into the body 504 togetherin one action.

The display 506 can be used in substantially the same way as the display406 of the ICC 400 embodiment described with reference to FIGS. 4(a) to(d).

FIG. 6(a) shows a front view of an ICC 600 according to an embodiment ofthe disclosure. FIG. 6(b) shows a rear view of the ICC 600. The ICC 600comprises a first integrated circuit module 602 and a second integratedcircuit module 604 arranged in a body 606. The first integrated circuitmodule 602 is proximal to a front surface of the ICC 600, and the secondintegrated circuit module 604 is proximal to a rear surface of the ICC600. In this embodiment, the body 606 is substantially the shape of astandard mini-SIM card but with two notched corners 608 a, 608 b(instead of one in a standard mini-SIM card) for aligning and locatingthe ICC 600 relative to contact pins on a user device. The additionalnotched corner (compared to the standard mini-SIM) enables the ICC 600to be reversible.

FIG. 6(c) shows a cross-sectional side view section along a line F-F ofthe ICC 600, in the region of the integrated circuit modules 602, 604.The body 606 comprises an opening 610 through the thickness of the body606. The first and the second integrated circuit modules 602, 604 arelocated in the opening 610.

The first integrated circuit module 602 comprises a front electricalcontact plate 612, a front circuit board 614, a front integrated circuit616 and front encapsulant 618. The second integrated circuit module 604comprises a rear electrical contact plate 620, a rear circuit board 622,a rear integrated circuit 624 and rear encapsulant 626. The firstintegrated circuit module 602 is substantially the same size as thesecond integrated circuit module 604.

FIG. 6(d) shows the shape of the recess 610 more clearly (illustratedwithout the integrated circuit modules 602, 604). The opening 610comprises a through portion 640, a front peripheral portion 642 and arear peripheral portion 644.

The front peripheral portion 642 is shallower than the thickness of thebody 606. The front peripheral portion 642 is arranged to contain thefront electrical contact plate 612 and the front circuit board 614 suchthat the front electrical contact plate 612 is substantially flush withthe front surface of the body 606. Accordingly, the depth of the frontperipheral portion 642 is substantially the same as the total combinedthickness of the front electrical contact plate 612 and the frontcircuit board 614.

Similarly, the rear peripheral portion 644 is shallower than thethickness of the body 606. The rear peripheral portion 644 is arrangedto contain the front electrical contact plate 620 and the rear circuitboard 622 such that the rear electrical contact plate 620 issubstantially flush with the rear surface of the body 606. Accordingly,the depth of the rear peripheral portion 644 is substantially the sameas the total combined thickness of the rear electrical contact plate 620and the rear circuit board 622.

The front electrical contact plate 612 is connected to a first side ofthe front circuit board 614, and the front integrated circuit 616 isconnected to a second side of the front circuit board 614. The frontintegrated circuit 616 is electrically insulated by the frontencapsulant 618.

The rear electrical contact plate 620 is connected to a first side ofthe rear circuit board 622, and the rear integrated circuit 624 isconnected to a second side of the rear circuit board 622. The rearintegrated circuit 624 is electrically insulated by the rear encapsulant626. The first integrated circuit module 602 is electrically isolatedfrom the second integrated circuit module 604.

The front integrated circuit 616 and the rear front integrated circuit624 each comprise a unique IMSI for connecting to cellulartelecommunications networks.

As the person skilled in the art will appreciate, modifications andvariations to the above embodiments may be provided, and furtherembodiments may be developed, without departing from the spirit andscope of the disclosure.

For example, FIGS. 7(a) to (d) show an ICC 600 which is an alternativeembodiment of the ICC 500 described with reference to FIGS. 5(a) to (d).The ICC 600 is substantially the same as the ICC 500 but the display 504extending along the rear of the ICC 600. The integrated circuit module502 may be inserted from one side of the ICC 600 (e.g. the rear side)then twisted relative to the hole through the card. The integratedcircuit module 502 can then be bonded from both sides in a single step.Alternatively, the front side and rear side modules may be inserted in atwo-step process and either electrically connected to each other (ifrequired) during the bonding process, or coupled wirelessly/opticallyfor the transmission of power/data between the front and rear modules.

The integrated circuit module of the ICC 400, 500 may comprise adifferent type of component, for example, a sensor in place of thedisplay (406 in the embodiment of FIG. 4 or 506 in the embodiment ofFIG. 5), and an integrated circuit for controlling the sensor in placeof the display driver integrated circuit. For example, the sensor may bea finger print sensor for authorizing the use of the ICC 400, 500 inpayment transactions if the ICC 400 was a transaction device. Othersuitable sensors to take the place of the display may include a pressuretransducer, a microphone or an electromagnetic acoustic transducer.Alternatively, the display may be replaced by an optical or andelectrical interconnect for communicating data between the ICC and anexternal device.

Embodiments of the Integrated Circuit Cards (ICCs) have been illustratedas ISO/IEC 7810:2003 ID-1 sized cards (i.e. standard credit card size)or as modified mini-SIM cards. However, the ICC may have any shape andsize, for example micro-SIM, nano-SIM or any arbitrary shape and size.

In the examples and embodiments described above which comprise at leasttwo integrated circuits (e.g. ICCs 200, 300, 400, 500, 600), the rearintegrated circuit may comprise a SIM and the front module may comprisea secure element (e.g. to be used in EMV transactions) or vice versa.The two integrated circuits may share a single package and/or electricalinterface.

Further, an ICC may be arranged for use with ‘contactless’ Near FieldCommunication (NFC) systems. In this example, an ICC may be providedwith two integrated circuits, one of which may comprise a secure elementcomprising a 2-wire NFC device. Upon insertion into a mobile device theNFC device may be arranged to be operatively connect to a mobile deviceantenna via unused contacts on the electrical contact plate of the ICC.

In the description above reference is made to electrical contact plates208, 312, 318, 412, 512, 612 and 620. Although these electrical contactshave been described as being in the form of an “electrical contactplate”, it should be appreciated that the electrical contacts (208, 312,318, 412, 512, 612 and 620) may take any convenient configuration/form.

The invention claimed is:
 1. An integrated circuit card comprising: acard body having an opening extending through the thickness of the cardbody; an electrical contact plate contained in the card body andsubstantially flush with the card body; and two components located inthe opening, wherein a first component of the two components includes anintegrated circuit.
 2. The integrated circuit card of claim 1, wherein asecond component of the two components includes one or more from a groupcomprising: an integrated circuit; a switch; a display; a sensor; atransducer; or a combination thereof.
 3. The integrated circuit card ofclaim 2, wherein the integrated circuit is operative to determine one ofa temporary Card Verification Value (CVV) and a machine readable code;and the display is operative to display one of the determined temporaryCVV and the machine readable code.
 4. The integrated circuit card ofclaim 1, wherein the two components have a combined thickness that issubstantially the same thickness as the card body.
 5. The integratedcircuit card of claim 4, wherein the card body comprises an uppersurface and a lower surface, and the two components within the openingcomprise an upper surface and a lower surface, wherein the upper and thelower surfaces of the two components are substantially flush with theupper and the lower surfaces of the card body.
 6. The integrated circuitcard of claim 4, wherein the card body comprises a rear side and a frontside, wherein the opening is larger at the front side than the rearside.
 7. The integrated circuit card of claim 1, wherein the integratedcircuit comprises an International Mobile Subscriber Identity.
 8. Theintegrated circuit card of claim 1, wherein the integrated circuitcomprises a secure element.
 9. The integrated circuit card of claim 1,further comprising a Near Field Communication antenna in communicationwith the integrated circuit.
 10. The integrated circuit card of claim 9,wherein the Near Field Communication antenna is arranged to connect tothe antenna of a mobile device.
 11. The integrated circuit card of claim1, wherein the card body comprises alignment means for aligning theintegrated circuit card relative to contact pins on a mobile device whenthe front side of the card is presented to the contact pins and whereinthe alignment means is arranged to align the card relative to thecontact pins when the back side of the card is presented to the contactpins.
 12. A method of making an integrated circuit card, the methodcomprising: providing a card body having an opening, a rear side and afront side, wherein the opening is larger at the front side than therear side of the card body; inserting a module in the opening from thefront side of the card, wherein the module is substantially the samethickness as the card body, and the module comprises two components, afront side and a rear side, wherein a first component of the twocomponents includes an integrated circuit; and arranging the integratedcircuit module so that the front side of the module is substantiallylevel with the front side of the card body, and the rear side of themodule is substantially level with the rear side of the card body. 13.An integrated circuit card made using the method of claim 12.